nanoSkunkWorkX raises $2M Seed
nanoSkunkWorkX: Develops graphene-copper thin-film interfaces that improve heat and current handling in AI chip packaging.
- Round
- Seed
- Amount
- $2M
- Announced
- Lead investors
- Tin Men Capital
- Headquarters
- Malaysia
More: nanoSkunkWorkX funding history · rounds in September 2026 · rounds in Malaysia